The nasa electronic Parts and Packaging (nepp) ‘02 Workshop




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The NASA Electronic Parts and Packaging



(NEPP) ‘02 Workshop
The

NASA Electronic Parts and Packaging

(NEPP) ‘02 Workshop

April 30 - May 2, 2002


Hilton

Nassau Bay & Marina

Houston, TX
Organized by:

NEPP Information, Management and Dissemination Project



Welcome to the Annual NEPP Workshop on Electronic Parts, Packaging, and Radiation Characterization for Space Applications! We’re happy you are with us and look forward to talking with you. Let’s start off with a few words about the NASA Electronic Parts and Packaging (NEPP) Program. The NEPP objectives are to:




  • Assess the reliability of newly available electronic parts and packaging technologies for usage on NASA projects through validations, assessments and characterizations and the development of test methods/tools.

  • Expedite infusion paths for advanced (emerging) electronic parts and packaging technologies by evaluations of readiness for manufacturability and project usage considerations.

  • Provide NASA Projects with technology selection, application, and validation guidelines for electronic parts and packaging hardware and processes.

  • Retain and disseminate electronic parts and packaging assurance, reliability validations, tools and availability information to the NASA community.

NEPP is organized around three technology concentrations and the Information Management and Dissemination effort. The technology concentrations are Electronic Parts (EPAR), Electronic Packaging (EPAC), and Electronic Radiation Characterization (ERC). The Information Management & Dissemination (IMD) project is responsible for making all NEPP products and deliverables accessible in a controlled manner and is coordinating this conference.


The Electronic Parts Project is tied to satisfying the needs of NASA programs/projects for evaluation of newly available and advanced electronic parts and maximizing effectiveness and efficiency through leveraging by teaming and partnering with industry and other agencies. The objective of the NEPP Electronic Packaging Project is to stay ahead of Mission project requirements by 18-24 months. The primary goal of the Project is to expedite cutting-edge technology into missions and instruments during the Mission Formulation phases, to obtain electronics packaging information, and to sustain the availability of that information for broad usage across the Agency, industry, academia, and other government agencies. The Electronics Radiation Characterization Project of NEPP characterizes the effects of radiation on electronics. Long and short term radiation effects such as total ionizing dose (TID), displacement damage (DD), and single event effects (SEE) provide aerospace designers’ a myriad of challenges for system design. The ERC Project is responsible for supporting NASA’s current and future needs for electronic systems in the natural space and terrestrial radiation environments.

Biographical Data


Lyndon B. Johnson Space Center

Houston, Texas 77058



National Aeronautics and

Space Administration
NAME: John D. Olivas (PhD.)

NASA Astronaut (Mission Specialist Candidate)


PERSONAL DATA: Born in North Hollywood, California, but considers El Paso, Texas to be his hometown. Married and has 4 children. Recreational interests include running weightlifting hunting, fishing, surfing, and mountain biking.
EDUCATION: Graduate of Burges High School, El Paso, Texas; received a bachelor of science degree in mechanical engineering from the University of Texas El Paso; a masters of science degree in mechanical engineering from the University of Houston and a doctorate in mechanical engineering and materials science from Rice University.
ORGANIZATIONS: American Society of Materials International (ASM International), Texas Registered Professional Engineer.
AWARDS: Four U.S. Patents; Four NASA Class One Tech Brief Awards; Five JPL California Institute of Technology Novel Technology Report Recognitions; HENAAC Most Promising Engineer, McDonald's Hispanos Triunfadores Award, NASA ASEE Summer Faculty Fellowship Award, Dow Life Saving Award.
EXPERIENCE: After graduating with his undergraduate degree, Olivas worked for the Dow Chemical Company in Freeport, Texas. While there, he was a mechanical/materials engineer responsible for performing equipment stress/failure analysis for the operating facilities. After completing his master's degree, Olivas left to pursue his doctorate while supporting engine-coating evaluations for C 5 maintenance operations at Kelly Air Force Base. He also supported the Crew and Thermal Systems Directorate at NASA Johnson Space Center, evaluating materials for application to the next generation Extravehicular Mobility Unit, during a summer intern.
Upon completing his doctorate, he was offered a senior research engineer position at the Jet Propulsion Laboratory (JPL). His research included the development of tools and methodologies for nondestructively evaluating microelectronics and structural materials subjected to space environments. He was promoted to Program Manager of the JPL Advanced Interconnect and Manufacturing Assurance Program aimed at evaluating die reliability and susceptibility of state of the art microelectronics for use in future NASA projects. Through his career, he has authored and presented numerous papers at technical conferences and in scientific journals and is principal developer of seven inventions.
NASA EXPERIENCE: NASA selected Olivas for assignment as Astronaut in 1998. Astronaut Training includes orientation briefings and tours, numerous scientific and technical briefings, intensive instruction in Shuttle and International Space Station system, physiological training and ground school to prepare for T 38 flight training, as well as learning water and wilderness survival techniques. He is currently assigned technical responsibilities within the Robotics Branch of the Astronaut Office. He serves as lead for the Special Purpose Dexterous Manipulator Robot, Mobile Transporter and the Mobile Base. System.
JUNE 2001


Tuesday, 30 April

8:00am

Welcome – Phil Zulueta, JPL

8:05

The NEPP Program – Chuck Barnes, NEPP Program Manager, JPL

8:15

Keynote Presentation – John D. Olivas, Ph.D, NASA Astronaut (Mission Specialist Candidate)




Session 1 – High Temperature Environments Session Chairs: Liangyu Chen, GRC

8:45

“New and Emerging Packaging Technologies for Harsh Environments”, Robert S. Okojie, GRC and Ender Savrun, Sienna Technologies et al

9:10

“High Temperature Reliability of PEMs Using New Molding Compounds”, F.P. McCluskey, A. Chandrasekaran and C. O'Connor, University of Maryland et al

9:35

“Structure Optimization of Wire-bond for High Temperature Operation”, Shun-Tien Lin, UTRC and Xiaodong Luo et al

10:00

Break




Session 2 – Low Temperature Environments I Session Chair: Mike Newell, JPL

10:20

“Ceramic Temperature Operation over Extreme Temperatures”, Elaine Gee, Muses-CN Nanorover Project, JPL

10:45

“SOI Device Optimization for Low Temperature and Radiation Tolerance”, Jagdish Patel, JPL, John Cressler, Ying Li, Auburn University

11:10

“Hot Carrier Degradation Effects in Power MOSFETs Operating at Cryogenic Temperatures”, Elaine Gee and Michael Newell, JPL

11:35

“Chip On Board, a path to Extreme Temperature Operation of Space Electronics”, Ken Hicks, JPL

12:00

Lunch




Session 3 - LaRC-MFC Technology Session Chair: James Bockman, LaRC

1:30

“Overview of NASA-Langley Macro-Fiber Composite (MFC) Piezoelectric Actuator Technology”, W. Keats Wilkie, Army Research Laboratory; LaRC

1:55

“Design and Characterization of Radial Field Diaphragms”, Robert G. Bryant, NASA Langley Research Center

2:20

“Reliability Testing of MFC Actuators”, James W. High et al, LaRC

2:45

“Miniaturizing High Voltage Amplifiers for Piezoelectric Actuators”, Paul Robinson and James Bockman, LaRC

3:10

Break




Session 4 – Innovative Qualification and Test Methods Session Chair: Phil Zulueta, JPL

3:25

“Fiber Optic Cable Assembly Characterization Studies at Goddard Space Flight Center”, Melanie Ott, GSFC

3:50

“Rapid Qualification of Area Array Package Assemblies by Increase of Ramp Rates and Temperature Ranges”, Reza Ghaffarian, JPL

4:15

“Qualification of SoC for Spacecraft Avionics Applications”, Jonathan Perret, JPL

4:40

“Characterization of Integrated Fiber Optical Modulators for Space Flight”, Melanie Ott, GSFC

5:05

MSU Activity…Ken LaBel, GSFC


Wednesday, 1 May




Session 5 – Radiation Hardness Assurance Session Chair: Kenneth LaBel, GSFC

8:00

“An Update on Linear Bipolar Enhanced Low Dose Rate Sensitivity (ELDRS)”, Allan Johnston, JPL

8:25

“Linear Single Event Transient Test Guidelines”, Stephen Buchner, GSFC/QSS

8:50

“Proton Testing - Lessons Learned”, Stephen Buchner, GSFC/QSS

9:15

“Updated Optocoupler Damage Data and Issues”, Allan Johnston, JPL

9:40

“Flight Validation Opportunities: Living With a Star's Space Environment Testbeds”, Ken LaBel, GSFC

10:05

Break




Session 6 – Optoelectronics Session Chair: Carl Magee, LaRC

10:20

“Performance Studies of AAA Semiconductor Pump Lasers for Space, Military and Avionics Applications”, Paul Rudy, Coherent, Inc.

10:45

“InGaAs/InP Avalanche Photodiodes Enable High Sensitivity Optical Communications and 3 Dimensional Imaging”, Marshall J. Cohen, J. Christopher Dries and Gregory H. Olsen, Sensors Unlimited

11:10

“Construction and Performance Characteristics of Simple, Low Cost Laser Diode Packages”, Edward F. Stephens, Ph.D., Cutting Edge Optronics

11:35

“Qualification of Diode Array Pumps for Military and Space-Based Laser Systems”, Dr. Ralph L. Burnham and Dr. Floyd E. Hovis, Fibertek, Inc., Herndon VA

12:00

Lunch




Session 7 – Low Temperature Environments II Session Chair: Richard Patterson, GRC

1:30

“Low Temperature Motor Controllers, Analog & Digital Electronics and Power Distributor Requirements for Next Generation Space Telescope”, Roger Stone and Matthew Jurotich, GSFC

1:55

“Semiconductor Device Options for Low Temperature Electronics”, R.K. Kirschman, Consultant

2:20

“Silicon-Germanium Power Devices at Low Temperatures for Deep Space Applications”, V.J. Kapoor and A. Vijh, Nanotechnology Research Center, University of Toledo

2:45

“Evaluation of Power Electronic Components and Systems at Cryogenic Temperatures For Space Missions”, Malik E. Elbuluk, Electrical Engineering Department, University of Akron

3:10

Break

3:25

“Ge-Based Semiconductor Devices for Cryogenic Power Electronics”, R.R. Ward and W.J. Dawson, GPD Optoelectronics Corp.




Session 8 – MEMS/MOEMS Session Chair: Rajeshuni Ramesham, JPL

3:50

“MEMS Packaging – Current Issues for Failure Analysis”, Jeremy A. Walraven, Sandia National Laboratories

4:15

“Development of Individually Addressable Micro-Mirror-Array for Space Applications”, Sanghamitra B. Dutta , GSFC

4:40

“Multilayered Structures for MEMS Applications”, Arturo A. Ayon, Sony Semiconductor


Thursday, 2 May




Session 9 – Advanced Sensors Session Chair: Alice Lee, JSC

8:00

“Electronic Nose for Space Program Application”, Rebecca Young, KSC

8:25

“Reproducibility of Responses in Polymer-Carbon Composite Films in an Electronic Nose Sensing Array”, M. A. Ryan, GRC

8:50

“Development and Application of High Temperature Sensors and Electronics”, Gary Hunter, GRC

9:15

“Gas Sensing Technologies for Hazardous Operations and Space Applications”, Todd Hong, SAIC

9:40

“A MEMS Rate Sensing Gyro for a Nano-Satellite”, Tim Straube, JSC

10:05

Break




Session 10 – Radiation Effects on Technology Session Chair: Kenneth LaBel, GSFC

10:20

“Recent Radiation Test Results on Commercial Network Chips and Topologies”, Stephen Buchner, GSFC/QSS

10:45

“Recent Proton Test Results on Fiber Optic Links”, Ken LaBel, GSFC

11:10

“Radiation Results on Advanced High-Density Memories”, Allan Johnston, JPL

11:35

“First Total Ionizing Dose Results on a Commercial Micromirror“, Allan Johnston, JPL

12:00

Lunch




Session 11 – Parts and Packaging Reliability Session Chair: Reza Ghaffarian, JPL

1:30

“Low Temperature Reliability of Electronic Packages/Assemblies for Space Missions”, Dick Patterson, GRC et al

1:55

“Electromigration Issues in State-of-the Art and Emerging Metallization Systems”, R. Leon, JPL et al

2:20

“Reliability Testing of Bulk Micro-Machined MEMS Devices”, Jeffery C. Gannon & Chris Behrens, Applied MEMS Inc.

2:45

“Reliability of Advanced Electronic Packaging”, Viswam Puligandla, Nokia

3:10

Break

3:25

“Reliability of CSP Assemblies with Underfill Subjected to 4,000 Extreme Temperature Cycles”, Reza Ghaffarian, JPL

3:50

“Board Level Screening of Pb-free Solder Alloys”, L. Del Castillo, JPL et al




Session 12 – COTS PEMS Session Chair: Choon Lee, JPL

4:15

“NEPP/NEPAG COTS Initiative”, Mike Sandor, JPL

4:40

“Reliability Characterization Testing of Advanced COTS PEMS Memories for NASA Applications”, Ashok K. Sharma/NASA-GSFC & Alexander Teverovsky/QSS/Goddard Operations

Session 1 – High Temperature Environments

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